Technical Library | 2014-11-13 19:23:50.0
With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology, particularly in the regime of high-power components, the temperature dependence of the long-term reliability is a critical parameter and has to be considered with highest possible care during the design phase (...) The aim of this paper is to give a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs. Furthermore, attention will be turned on the development of copper filled thermal vias in thin board constructions...
Technical Library | 2020-06-19 19:08:14.0
The designs of electronic devices and systems are being continuously improved by becoming smaller in size and faster in communication speed. The potential risk associated with these specific design improvements will be an increase in power density and, consequently, a greater risk of thermal problems and failures. At the same time, the prevailing use of circuit boards integrated with power devices such as motor controllers and drivers, light-emitting diode (LED) lighting modules, power supplies, and amplifiers, and regulators for TV, etc., drive to the use of a proper thermal management system while designing these kinds of printed circuit board (PCB).
Technical Library | 2009-07-22 18:33:41.0
This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV.
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